Pixel pitch of LED displays is a crucial factor you should consider. For outdoors, you may need a LED display with high brightness but less requirement for pixel pitches. Normally, outdoor LED displays exceed P2.0 and higher in pixel pitch. But if you need high definition for stage or indoor display, small pixel pitch LED display is necessary. In recent years, as LED technology evolves, small pixel pitch LEDs has expanded LED display application for indoor usages. As demand for smaller and smaller pixel pitch LED displays raised, Mini LED and Micro LED displays emerged, hence the MiP technology was born and MiP LED displays become more and more popular.

 

What is MiP LED Display?

 

MiP stands for Micro LED in Package, which is a new LED packaging technology based on Micro LED. MiP technology dices Mini/Micro LED panels into small pieces and packages each piece independently. It increases yield and prominently lowers cost for LED display manufacturing.

 

MiP Technology Procedures

 

MiP technology follows a common procedure for LED packaging as below picture shows.

 

Common Methods of MiP technology

 

There are two common methods for MiP LED packaging, one is the integrated pixel packaging and the other is the independent pixel packaging.

 

Kinglight MiP series LED display lamps adopt independent pixel packaging technology.

 

Advantages of MiP LED display

 

As an innovative packaging technology for Micro LED, MiP enables seamless integration of LED chips and discrete devices and brings Micro LED displays more possibilities and advantages.

 

1. Better displaying effect

 

With full measurement of Micro RGB pixel, color sorting and mixing, MiP LED display lamps have extremely high brightness, contrast, and color consistency from different viewing angles.

 

2. Much less maintenance

 

MCOB module based on MiP mounting has consistent ink color and needs no correction through its impeccable light splitting and color mixing features. Much less maintenance is required for MiP LED devices.

 

Once a bad lamp is detected, it can be removed and replaced easily without affecting the rest lamps on the whole screen.

 

3. Wide compatibility

 

MiP technology enables mass production to reduce wafer cost while traditional COB technology has strict requirement for mini LED chips, which results in more cost for upstream LED chip factories investing on light and color splitting, bin mixing, etc.

 

4. Much lower cost

 

1^st, MIP packaging technology complies with existing equipment, which prominently reduces the cost for new equipment and also R&D investment.

 

2^nd, MIP packaging technology effectively decreases defective screening rate and reduces downstream rework costs.

 

5. Good protection

 

MiP packaging technology gives LED lamps perfect proof of dust, moisture and static electricity.

 

6. Better heat dissipation

 

MiP LED module has better heat dissipation which means less power consumption and temperature rise.

 

Comparisons with SMD, COB, IMD LED technologies

 

1. SMD technology is the most mature LED package technology but has drawbacks in reliability. Damaged LED diodes or failures can happen during production process. Another shortcoming of SMD technology is due to its physical size, which means it’s difficult to reach a pixel pitch below P1.0.

 

2. COB technology can reach small pitches even like mini-LED and micro-LED; the shortcoming for COB lamps can be its maintenance. It’s difficult to repair a single lamp on a COB module. When welding, a ring can be left on the surrounding lamps.

 

3. IMD technology is a combination of SMD and COB. IMD covers small pixel pitches between 0.4 – 0.9mm and has better anti-bumping feature than SMD technology. One IMD can be used for only pixel pitch.