Suitable for P2.6(or above) transparent LED displays
Adopts full flip chip design on driver IC and RGB chips , no wire bonding for higher reliability
Supports break point continual signal transmission, one pixel failure won’t affect the entire screen
Supports cold solder joint detection, enabling identification of cold soldering on communication port I/O pins and effectively preventing defective products
Energy-efficient design delivering over 3,500 nits of brightness with power consumption kept below 400 watts
