9 Common Procedures of LED Packaging
Optronics Industry | 2024-01-13

LED packaging involves several common procedures that are performed to protect the LED chip, provide electrical connections, and enhance the overall performance and reliability of the LED device. Here are the 9 common procedures involved in LED packaging, including die attach, wire bonding, encapsulation, lead frame trimming, lead forming, lens attachment, electrical testing, sorting and bin classification, and tape and reel packaging.


  1. Die Attach


The LED chip is attached to a lead frame or substrate using a conductive adhesive or solder. The die attach process ensures proper electrical contact and thermal management.

Kinglight LED Packaging-Die Attach Line

Die attach lines at Kinglight LED production base located in Suzhou, China


  1. Wire Bonding


Fine wires (usually gold or aluminum) are used to connect the LED chip to the lead frame or substrate. Wire bonding provides electrical connectivity between the chip and external contacts.

Kinglight production line for wire bonding of LED packaging

Kinglight production line for wire bonding of LED packaging


  1. Encapsulation


The LED chip, wire bonds, and other sensitive components are encapsulated with a protective material, such as epoxy resin or silicone. Encapsulation shields the chip from external elements and provides mechanical support.

LED Packaging - Encapsulation

Encapsulation at Kinglight LED packaging production lines



  1. Lead Frame Trimming


Excess lead frame material is removed by trimming to achieve the desired lead length and shape. This process facilitates subsequent assembly and electrical connections.


  1. Lead Forming


The leads or terminals of the LED package are shaped to match specific requirements, such as through-hole or surface-mount configurations. Lead forming ensures proper connection and mounting.


  1. Lens Attachment


In some LED packages, a lens is attached to control the direction and distribution of light emitted by the LED chip. The lens can be transparent or may include specialized optics, such as reflectors or diffusers.


  1. Electrical Testing:


Packaged LEDs undergo electrical testing to verify their functionality and performance. Parameters such as forward voltage, forward current, luminous intensity, and color temperature are measured.


  1. Sorting and Bin Classification:


Packaged LEDs are sorted into different bins based on their electrical and optical characteristics. This categorization ensures consistent performance and enables manufacturers to meet specific customer requirements.

Kinglight LED Packaging-Sorting & Bin Classification

Kinglight LED Packaging-Sorting & Bin Classification



  1. Tape and Reel Packaging:


In many cases, the packaged LEDs are placed into tape and reel packaging (also known as carrier tape). The components are mounted on a continuous tape with pockets, allowing for automated handling during manufacturing and assembly processes.

kinglight LED Packaging-Tape & Reel Packaging

Kinglight LED Packaging-Tape & Reel Packaging


These procedures may vary depending on the specific LED package type, manufacturing technology, and product specifications. LED manufacturers follow stringent quality control measures to ensure consistent performance and adherence to industry standards throughout the packaging process.